Bending strength of CFRP laminated adhesive joints fabricated by vacuum-assisted resin transfer molding. (1st January 2019)

• Record Type: Journal Article
• Authors: Abusrea, Mahmoud R.; Han, Seung-Wook; Arakawa, Kazuo; Choi, Nak-Sam
• Is Part Of: Composites. Number 156(2019)
• Page Start: 8
• Page End: 16
• Publication Date: 2019-01-01
• Subjects: CFRP joints -- Vacuum-assisted resin transfer molding -- Bending strength -- Joint efficiency -- Acoustic emission; Composite materials -- Periodicals; Materials science -- Periodicals; Composite materials; Periodicals; Electronic journals; 620.118
• DOI: 10.1016/j.compositesb.2018.08.041
• Languages: English
• ISSNs: 1359-8368

Abstract

Abstract: The laminated joints used in this work were adhesive joints constructed using two dry carbon fiber halves. Some improvements were introduced to the joints to enhance their bending strength performance: stitching of the two halves together by fiber bundles and inserting extra carbon fiber covers in the joint connection. We studied three adhesive joints: a conventional basic and two improved laminated joints. All joint specimens were fabricated using a vacuum-assisted resin transfer molding (VARTM) process. The joints were evaluated with a bending test, and were compared to the bending strength of a jointless carbon fiber reinforced plastic (CFRP) laminate. Two acoustic emission (AE) sensors were placed on the specimen to monitor the fracture progresses during the test. The improved laminated joints, stitched and multiple-cover overlapped joints, showed enhanced bending strength and joint efficiency. The improvement depended significantly on the number of carbon fiber layers. The maximum increase was 24% for the stitched laminated joint of 5 layers and 58% for the multiple-overlapped joint of 6 layers, respectively. Such high joint efficiency was due to the effect of the carbon fiber reinforcement on the joints, by which many carbon fibers supported the strength in advance of reaching the maximum load point, as confirmed by AE measurement analysis.