Micro-diamond assisted bidirectional tuning of thermal conductivity in multifunctional graphene nanoplatelets/nanofibrillated cellulose films. (15th April 2022)

• Record Type: Journal Article
• Authors: Zhang, Yinhang; Wang, Wei; Zhang, Fei; Huang, Lingqi; Dai, Kun; Li, Chuanbing; Liu, Dan; Sun, Yuxuan; Ren, Danhui; Wu, Jinyi; Zheng, Qingbin
• Is Part Of: Carbon. Volume 189(2022)
• Page Start: 265
• Page End: 275
• Publication Date: 2022-04-15
• Subjects: Thermal interface materials -- Thermal conductivity -- Graphene -- Joule heating; Carbon -- Periodicals; Carbone -- Périodiques; Koolstof; Toepassingen; Electronic journals; 546.681
• DOI: 10.1016/j.carbon.2021.12.067
• Languages: English
• ISSNs: 0008-6223

Abstract

Abstract: Environmentally friendly thermal interface materials (TIMs) with bidirectional high thermal conductivities have aroused considerable interests for addressing the heat dissipation issue in integrated circuits. Although graphene-based TIMs exhibit excellent in-plane thermal conductive performance, their through-plane thermal conductivity is commonly less than 3 Wm −1 K −1 owing to the vast interfacial phonon scattering, significantly limiting their practical applications. In this study, a strategy aimed at building TIMs with controllable heat transfer pathways both along the in-plane and through-plane directions is proposed by incorporating micron-diamonds (MDs) in graphene nanoplatelets/nanofibrillated cellulose (GNPs/NFC) composite film via a facile and green self-assembly method. The morphology of the obtained MDs@GNPs/NFC composite film can be precisely tailored from a hierarchical structure to a 3D solid foam-like structure to tailor heat transfer paths. By adjusting the loading and particle size of MDs, a through-plane thermal conductivity of 8.85 Wm −1 K −1 was achieved accompanied with a simultaneously high in-plane thermal conductivity of 32.01 Wm −1 K −1 . The excellent bidirectional thermal conductive performance is integrated with high-efficiency Joule heating capability, outstanding nonflammability, as well as superior electromagnetic shielding performance, showing a promising future in advanced electronic devices. Graphical abstract: Image 1