Advances in interfacial engineering for enhanced microbial extracellular electron transfer. (February 2022)

• Record Type: Journal Article
• Authors: Wang, Yi-Xuan; Hou, Nannan; Liu, Xiao-Li; Mu, Yang
• Is Part Of: Bioresource technology. Volume 345(2022)
• Publication Date: 2022-02
• Subjects: Extracellular electron transfer -- Microbial electrochemical technology -- Interfacial engineering -- Electroactive microbes; Biomass -- Periodicals; Biomass energy -- Periodicals; Bioremediation -- Periodicals; Agricultural wastes -- Periodicals; Factory and trade waste -- Periodicals; Organic wastes -- Periodicals; Bioénergie -- Périodiques; Déchets agricoles -- Périodiques; Déchets industriels -- Périodiques; Déchets organiques -- Périodiques; Déchets (Combustible) -- Périodiques; 662.88
• DOI: 10.1016/j.biortech.2021.126562
• Languages: English
• ISSNs: 0960-8524

Abstract

Graphical abstract: Highlights: A review on current status of interfacial engineering enhances microbial EET. The strengthening mechanisms of microbial EET are summarized. Limitations of existing interfacial engineering methods are discussed. Challenges and futuristic prospects of interfacial engineering are highlighted. Abstract: The extracellular electron transfer (EET) efficiency between electroactive microbes (EAMs) and electrode is a key factor determining the development of microbial electrochemical technology (MET). Currently, the low EET efficiency of EAMs limits the application of MET in the fields of organic matter degradation, electric energy production, seawater desalination, bioremediation and biosensing. Enhancement of the interaction between EAMs and electrode by interfacial engineering methods brings bright prospects for the improvement of the EET efficiency of EAMs. In view of the research in recent years, this mini-review systematically summarizes various interfacial engineering strategies ranging from electrode surface modification to hybrid biofilm formation, then to single cell interfacial engineering and intracellular reformation for promoting the electron transfer between EAMs and electrode, focusing on the applicability and limitations of these methodologies. Finally, the possible key directions, challenges and opportunities for future interfacial engineering to strengthen the microbial EET are proposed in this mini-review.