P.141L: Late‐News Poster: ALD‐based Multilayer Encapsulation of PIN OLED: On the Stability of the Organic Layer in 85°C / 85% RH Storage Conditions. Issue 1 (1st July 2013)

• Record Type: Journal Article
• Authors: Simon, Jean‐Yves; Maindron, Tony; Aventurier, Bernard; Gatta, Sylvia Meunier Della; Viasnoff, Emilie; Jullien, Tony; Ghazouani, Ahlem; Lafond, Dominique
• Is Part Of: Digest of technical papers. Volume 44:Issue 1(2013)
• Page Start: 1470
• Page End: 1472
• Publication Date: 2013-07-01
• Subjects: Organic light‐emitting diodes -- thin‐film encapsulation -- stability -- dark spots -- IEC 60068‐2‐67; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/j.2168-0159.2013.tb06524.x
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract: A multilayer thin‐film encapsulation process based on the use of Atomic Layer Deposition of Al2 O3 for organic light‐emitting diodes (OLED) has been presented at the last SID Display Week 2012 by LETI. It is based on the use of a generic stack of the kind Al2 O3 /organic layer/inorganic layer. When comes the time to evaluate the performances of this stack in severe climatic storage conditions, it turns out that the intrinsic stability of the organic decoupling layer becomes of outmost importance. This work details the behavior of the thin film barrier stack when exposed to 85 °C / 85 %RH climatic conditions.