Printed copper-nanoplate conductor for electro-magnetic interference. (21st December 2021)

• Record Type: Journal Article
• Authors: Li, Changning; Khuje, Saurabh; Petit, Donald; Huang, Yulong; Sheng, Aaron; An, Lu; Di Luigi, Massimigliano; Jalouli, Alireza; Navarro, Marieross; Islam, Abdullah; Ren, Shenqiang
• Is Part Of: Nanotechnology. Volume 33:Number 11(2022)
• Publication Date: 2021-12-21
• Subjects: copper nanoplates -- conductive ink -- size engineering -- high-temperature conductor; Nanotechnology -- Periodicals; Nanotechnology -- Periodicals; Nanotechnology; Publications périodiques; Nanotechnologies; Periodicals; 620.5
• DOI: 10.1088/1361-6528/ac40bc
• Languages: English
• ISSNs: 0957-4484

Abstract

Abstract: As one of the conductive ink materials with high electric conductivity, elemental copper (Cu) based nanocrystals promise for printable electronics. Here, single crystalline Cu nanoplates were synthesized using a facile hydrothermal method. Size engineering of Cu nanoplates can be rationalized by using the LaMer model and the versatile Cu conductive ink materials are suitable for different printing technologies. The printed Cu traces show high electric conductivity of 6 MS m −1, exhibiting electro-magnetic interference shielding efficiency value of 75 dB at an average thicknesses of 11 μ m. Together with flexible alumina ceramic aerogel substrates, it kept 87% conductivity at the environmental temperature of 400 °C, demonstrating the potential of Cu conductive ink for high-temperature printable electronics applications.