A low‐profile transmitarray antenna using square patch elements with cross dipole slots and vias. Issue 4 (24th December 2019)

• Record Type: Journal Article
• Authors: Zhu, Hong; Guo, Lu; Feng, Wenjie
• Is Part Of: International journal of RF and microwave computer-aided engineering. Volume 30:Issue 4(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2019-12-24
• Subjects: cross dipole slot -- high gain -- low‐profile -- metallic via -- square patch element -- transmitarray antenna; Microwave devices -- Computer-aided design -- Periodicals; Computer-aided engineering -- Periodicals; 621.3813
• DOI: 10.1002/mmce.22106
• Languages: English
• ISSNs: 1096-4290

Abstract

Abstract: A low‐profile transmitarray antenna comprising only a single‐layer substrate and operating at X‐band is presented in this paper. The element consists of two identical metallic layers placed on the upper and lower surfaces of a single‐layer substrate and four vias connecting two metal layers through the substrate. The thickness of the element is 3 mm, corresponding to only 0.1 λ at the design frequency. Metallic layers contain square patches etched with cross dipole slots. By varying the side length of the square patch and adjusting the dimensions of cross dipole slots as well as the locations of the vias, a phase shift of 340° is achieved. A transmitarray using the novel elements is simulated, fabricated, and tested. The simulation and the measurement agree well and the gain at 10 GHz is 25.4 dBi, equivalent to an aperture efficiency of 49%. The low‐profile configuration and satisfactory behavior make this design an appealing candidate for space applications.