A universal dental adhesive containing copper nanoparticles stabilizes the hybrid layer in eroded dentin after 1 year. (March 2022)
- Record Type:
- Journal Article
- Title:
- A universal dental adhesive containing copper nanoparticles stabilizes the hybrid layer in eroded dentin after 1 year. (March 2022)
- Main Title:
- A universal dental adhesive containing copper nanoparticles stabilizes the hybrid layer in eroded dentin after 1 year
- Authors:
- Hanzen, Taíse Alessandra
Gutiérrez, Mario Felipe
de Paris Matos, Thalita
Mara de Paula, Alexandra
Figueredo de Siqueira, Fabiana Suelen
Millán Cardenas, Andrés Felipe
Viteri-Garcia, Andres
Hernandez, Marcela
Loguercio, Alessandro D.
Reis, Alessandra - Abstract:
- Abstract: This study evaluated the matrix metalloproteases (MMP) inhibition of the copper nanoparticles (CuNp), and the effects of their addition into a universal adhesive system on antimicrobial activity (AMA), ultimate tensile strength (UTS), water sorption (WS), solubility (SO), as well as the 24h and 1y microtensile bond strength (μTBS), nanoleakage (NL) and in situ degree of conversion (DC), on sound and eroded dentin. Anti-MMP activity was evaluated for MMP-2, -8 and -9. CuNp (0%[control] and 0.1 wt%) were added into Ambar Universal. Antimicrobial activity against S. mutans was tested using agar diffusion. For UTS, specimens were tested after 24h and 28d. WS and SO were evaluated during 56d. After induced erosion, adhesives and composite were applied to flat dentin surfaces, and specimens were sectioned to obtain resin–dentin sticks, which were used for evaluation of μTBS and nanoleakage at the 24h and 1y periods. DC was evaluated at the 24h period in these beam-like specimens. Data were submitted to appropriate statistical analyses (α = 0.05). CuNp demonstrated anti MMP-activity ( p < 0.05) besides providing antimicrobial activity ( p < 0.05), as well as maintained stable μTBS and NL values over 1-year, for both substrates ( p < 0.05). Thus, CuNp may prevent the degradation of the adhesive interface, mainly in eroded dentin. Clinical relevance: Copper-containing universal adhesives could be considered a feasible alternative to improve adhesive properties to soundAbstract: This study evaluated the matrix metalloproteases (MMP) inhibition of the copper nanoparticles (CuNp), and the effects of their addition into a universal adhesive system on antimicrobial activity (AMA), ultimate tensile strength (UTS), water sorption (WS), solubility (SO), as well as the 24h and 1y microtensile bond strength (μTBS), nanoleakage (NL) and in situ degree of conversion (DC), on sound and eroded dentin. Anti-MMP activity was evaluated for MMP-2, -8 and -9. CuNp (0%[control] and 0.1 wt%) were added into Ambar Universal. Antimicrobial activity against S. mutans was tested using agar diffusion. For UTS, specimens were tested after 24h and 28d. WS and SO were evaluated during 56d. After induced erosion, adhesives and composite were applied to flat dentin surfaces, and specimens were sectioned to obtain resin–dentin sticks, which were used for evaluation of μTBS and nanoleakage at the 24h and 1y periods. DC was evaluated at the 24h period in these beam-like specimens. Data were submitted to appropriate statistical analyses (α = 0.05). CuNp demonstrated anti MMP-activity ( p < 0.05) besides providing antimicrobial activity ( p < 0.05), as well as maintained stable μTBS and NL values over 1-year, for both substrates ( p < 0.05). Thus, CuNp may prevent the degradation of the adhesive interface, mainly in eroded dentin. Clinical relevance: Copper-containing universal adhesives could be considered a feasible alternative to improve adhesive properties to sound and eroded dentin after 1-year. … (more)
- Is Part Of:
- International journal of adhesion & adhesives. Volume 113(2022)
- Journal:
- International journal of adhesion & adhesives
- Issue:
- Volume 113(2022)
- Issue Display:
- Volume 113, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 113
- Issue:
- 2022
- Issue Sort Value:
- 2022-0113-2022-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-03
- Subjects:
- Universal adhesive system -- Copper -- Nanoparticles -- Microtensile bond strength -- Nanoleakage -- Degree of conversion
Adhesion -- Periodicals
Adhesives -- Periodicals
Adhésion (Physique) -- Périodiques
Adhésifs -- Périodiques
Adhesie
Kleefstoffen
Adhesion
Adhesives
Periodicals
668.3 - Journal URLs:
- http://books.google.com/books?id=1IBTAAAAMAAJ ↗
http://www.sciencedirect.com/science/journal/01437496 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.ijadhadh.2021.103041 ↗
- Languages:
- English
- ISSNs:
- 0143-7496
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 4541.560000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 20503.xml