A flexible and fully integrated wearable pressure sensing chip system for multi-scenario applications. Issue 47 (24th November 2021)

• Record Type: Journal Article
• Authors: Peng, Bo; Wu, Xinyue; Zhang, Chao; Zhang, Chi; Lan, Lingyi; Zhang, Chuanfang (John); Ying, Yibin; Ping, Jianfeng
• Is Part Of: Journal of materials chemistry. Volume 9:Issue 47(2021)
• Page Start: 26875
• Page End: 26884
• Publication Date: 2021-11-24
• Subjects: Materials -- Research -- Periodicals; Chemistry, Analytic -- Periodicals; Environmental sciences -- Research -- Periodicals; 543.0284
• DOI: 10.1039/d1ta08584k
• Languages: English
• ISSNs: 2050-7488

Abstract

Abstract : A wearable pressure sensor is fabricated by the growth of AgNPs on MXene-coated sponge. Its sensitivity can be tuned by changing AgNPs growing density. A fully integrated sensing chip is developed by integrating the sensor with FPCB on PI film. Abstract : Wearable pressure sensors have gained widespread popularity. However, they fail to meet the demand of multi-scenarios applications and large-scale fabrication. Herein, we report a flexible, fully integrated, and wireless pressure sensing chip system by integrating a sensitivity-tunable sensor with a flexible printed circuit board on polyimide films. The sensor incorporates laser-induced graphene-based interdigitated electrode with a conductive sponge fabricated by in situ growth of silver nanoparticles (AgNPs) on a MXene-coated sponge. The sensitivity can be tuned by changing the growth density of AgNPs, with a higher density of AgNPs corresponding to higher sensitivity. The highest sensitivity can reach 0.90 kPa −1, which is higher than the sensor without AgNPs (0.10 kPa −1 ). This system is expected to find applications in multi-scenarios, such as fruit growth and pulse signal. All these studies indicate that this integrated sensing chip system possesses the potential in improving the fabrication efficiency and sensing convenience for future wearable electronics.