Cite
HARVARD Citation
Dang, C. et al. (2022). Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries. Journal of materials science & technology. pp. 193-202. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Dang, C. et al. (2022). Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries. Journal of materials science & technology. pp. 193-202. [Online].