Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. (1st February 2022)
- Record Type:
- Journal Article
- Title:
- Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. (1st February 2022)
- Main Title:
- Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5
- Authors:
- Yang, Wenhui
Tran, Xuan Quy
Yamamoto, Tomokazu
Aso, Kohei
Somidin, Flora
Tan, Xin Fu
Kawami, Youichirou
Nogita, Kazuhiro
Matsumura, Syo - Abstract:
- Abstract: The Cu6 Sn5 intermetallic, which commonly forms at the solder interconnects, is a critical component contributing to the reliability of today's electronic products. It has been established that the structural control of its hexagonal η -Cu6 Sn5 polymorph can be achieved over a wide temperature range of service conditions via chemical doping with Ni or Au, effectively suppressing the undesirable hexagonal to monoclinic ( ƞ → ƞ′ ) phase transition at 186 °C and its associated volume change. In this study, we further investigate the effects of Ni (26.5 at%) and Au (9 at%), with high doping/alloying contents, on the atomic-scale structure of η -Cu6 Sn5 using a suite of microscopy techniques including atomic-resolution imaging, chemical mapping, electron diffraction, and in-situ heating, coupled with advanced data informatics. Our study reveals that while Ni occupancy takes place in both the Cu1 and Cu2 sites of η -Cu6 Sn5 in substantial amounts, Au is mostly substituted at the Cu1 sites of η -Cu6 Sn5 . Most interestingly, characteristic occupational modulations of the Cu6 Sn5 structure arise with each type of dopants: a three-fold ordered structure for Ni accompanied by a displacive modulation of the constituent atoms, but a two-fold layer-like structure for Au. Moreover, with a high content of Ni, the unit cell of η -Cu6 Sn5 is found to contract along its hexagonal ah axis relative to the Ni-dilute case, but anisotropically expands the ch axis in a bimodal fashion;Abstract: The Cu6 Sn5 intermetallic, which commonly forms at the solder interconnects, is a critical component contributing to the reliability of today's electronic products. It has been established that the structural control of its hexagonal η -Cu6 Sn5 polymorph can be achieved over a wide temperature range of service conditions via chemical doping with Ni or Au, effectively suppressing the undesirable hexagonal to monoclinic ( ƞ → ƞ′ ) phase transition at 186 °C and its associated volume change. In this study, we further investigate the effects of Ni (26.5 at%) and Au (9 at%), with high doping/alloying contents, on the atomic-scale structure of η -Cu6 Sn5 using a suite of microscopy techniques including atomic-resolution imaging, chemical mapping, electron diffraction, and in-situ heating, coupled with advanced data informatics. Our study reveals that while Ni occupancy takes place in both the Cu1 and Cu2 sites of η -Cu6 Sn5 in substantial amounts, Au is mostly substituted at the Cu1 sites of η -Cu6 Sn5 . Most interestingly, characteristic occupational modulations of the Cu6 Sn5 structure arise with each type of dopants: a three-fold ordered structure for Ni accompanied by a displacive modulation of the constituent atoms, but a two-fold layer-like structure for Au. Moreover, with a high content of Ni, the unit cell of η -Cu6 Sn5 is found to contract along its hexagonal ah axis relative to the Ni-dilute case, but anisotropically expands the ch axis in a bimodal fashion; in contrast, the effect of Au appears to be of an isotropically expanding nature. Graphical abstract: Image, graphical abstract . … (more)
- Is Part Of:
- Acta materialia. Volume 224(2022)
- Journal:
- Acta materialia
- Issue:
- Volume 224(2022)
- Issue Display:
- Volume 224, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 224
- Issue:
- 2022
- Issue Sort Value:
- 2022-0224-2022-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-02-01
- Subjects:
- η-Cu6Sn5 -- Structural modulation -- Long-range ordering -- Atomic-resolution XEDS mapping -- Poisson NLPCA
Materials -- Periodicals
Materials science -- Periodicals
Materials -- Mechanical properties -- Periodicals
Metallurgy -- Periodicals
Chemistry, Inorganic -- Periodicals
620.112 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13596454 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.actamat.2021.117513 ↗
- Languages:
- English
- ISSNs:
- 1359-6454
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 0629.920000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 20388.xml