Cite
HARVARD Citation
Wei, W. et al. (2022). Imidazole derivative with an intramolecular hydrogen bond as thermal latent curing accelerator for epoxy/phenolic resins. Journal of applied polymer science. 139 (14), p. n/a. [Online].
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Wei, W. et al. (2022). Imidazole derivative with an intramolecular hydrogen bond as thermal latent curing accelerator for epoxy/phenolic resins. Journal of applied polymer science. 139 (14), p. n/a. [Online].