Cite
HARVARD Citation
Behfar, M. et al. (2021). Failure Mechanisms in Flip‐Chip Bonding on Stretchable Printed Electronics. Advanced engineering materials. 23 (12), p. n/a. [Online].
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Behfar, M. et al. (2021). Failure Mechanisms in Flip‐Chip Bonding on Stretchable Printed Electronics. Advanced engineering materials. 23 (12), p. n/a. [Online].