Protein-induced decoration of applying MXene directly to UHMWPE fibers and fabrics for improved adhesion properties and electronic textiles. (8th February 2022)

• Record Type: Journal Article
• Authors: Yu, Jiali; Chen, Houdao; Huang, Heng; Zeng, Minling; Qin, Jiaying; Liu, Huichao; Ji, Muwei; Bao, Feng; Zhu, Caizhen; Xu, Jian
• Is Part Of: Composites science and technology. Volume 218(2022)
• Publication Date: 2022-02-08
• Subjects: UHMWPE fiber -- MXene -- Bovine serum albumin -- Interfacial properties -- Conductivity; Composite materials -- Periodicals; Composite materials; Fibrous composites; Periodicals; 620.118
• DOI: 10.1016/j.compscitech.2021.109158
• Languages: English
• ISSNs: 0266-3538

Abstract

Abstract: MXene, as an attractive functional and structural material with high conductivity, wettability, surface activity and plenty of superior mechanical properties, is applied for the first time to directly decorate ultra-high molecular weight polyethylene fiber (UHMWPE) and fabrics with a unique bovine serum albumin (BSA)-induced technology. The adoption of BSA successfully turns UHMWPE fiber into an adhesive platform toward the efficient assembly and wrapping of MXene. The results showed that the functionalization of MXene changed the UHMWPE fiber surface topography and increased the wettability and surface activity, which can enhance the mechanical engagement and offer sufficient reactive sites with resin matrix, providing efficiently improved interfacial properties. The interfacial shear strength between the UHMWPE/BSA/MXene fiber and epoxy increased by 116% when compared with pristine UHMWPE fiber. Besides, the peeling strength of MXene decorated UHMWPE fabric/rubber laminate demonstrates more than two times higher than the untreated UHMWPE fabric reinforced rubber composite. Furthermore, with the excellent conductivity of MXene, the UHMWPE/BSA/MXene fiber exhibits an electrical conductivity of 106 S/m, which is able to work as a conductor for the application of electronic textiles. Graphical abstract: Image 1