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HARVARD Citation
Choi, J. et al. (2021). A new cure kinetics model to simulate thermomechanical behavior of polymeric sealants for automotive applications. Functional composites and structures. p. . [Online].
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Choi, J. et al. (2021). A new cure kinetics model to simulate thermomechanical behavior of polymeric sealants for automotive applications. Functional composites and structures. p. . [Online].