Low dielectric resins derived from hyperbranched carbosilane oligmers functionalized by benzocyclobutene groups. Issue 1 (1st January 2021) - Li, Xian
ABSTRACT: Polycarbosilanes have been considered as potential materials used in electronic packaging and circuit boards owing to their excellent low-dielectric performance. In this work, we prepared new hyperbranched carbosilane oligomers (HCBOs) which were functionalized by benzocyclobutene (BCB) groups. HCBOs can be thermally cured to produce transparent (HCBRs) with low dielectric constant and high thermostability.