A model to quantify the relation between cognitive performance and thermal responses in high temperature at a moderate activity level. (January 2022)
- Record Type:
- Journal Article
- Title:
- A model to quantify the relation between cognitive performance and thermal responses in high temperature at a moderate activity level. (January 2022)
- Main Title:
- A model to quantify the relation between cognitive performance and thermal responses in high temperature at a moderate activity level
- Authors:
- Liu, Weiwei
Tian, Xiaoyu
Tao, Meihui - Abstract:
- Abstract: The cognitive impairment by high temperature is an important reason leading to physical work accidents. However, no quantitative mechanism models can be applied to describe the effect of high temperature on cognitive performance. In this study, we proposed a new association model between heat stress and cognitive performance (TSCI-CP model), which is based on the comprehensive heat stress index (TSCI) reflecting the combination influence of multiple thermal response factors. The quadratic regression models TSCI-CP from the climate-controlled experimental data with high temperature under moderate activity level. The determined coefficient R 2 of fitting models involved the majority of cognitive tests is higher than 0.8, indicating that these models reasonably reflect the quantitative association between cognitive test scores and TSCI. The TSCI-CP model demonstrates that the influence of high temperature on the cognitive test depends on the increased degree of heat stress. With the increase of TSCI, the accuracy and speed of cognitive test show opposite trends, namely the accuracy first increases and then decreases, the speed first drops and then rises. Thus, it gives a new view reflecting the association between heat stress and cognitive performance under high temperature. The TSCI-CP model provides a theoretical basis for evaluating the influence of high temperature on cognitive performance quantitatively. Highlights: Quantify the influence degree of thermalAbstract: The cognitive impairment by high temperature is an important reason leading to physical work accidents. However, no quantitative mechanism models can be applied to describe the effect of high temperature on cognitive performance. In this study, we proposed a new association model between heat stress and cognitive performance (TSCI-CP model), which is based on the comprehensive heat stress index (TSCI) reflecting the combination influence of multiple thermal response factors. The quadratic regression models TSCI-CP from the climate-controlled experimental data with high temperature under moderate activity level. The determined coefficient R 2 of fitting models involved the majority of cognitive tests is higher than 0.8, indicating that these models reasonably reflect the quantitative association between cognitive test scores and TSCI. The TSCI-CP model demonstrates that the influence of high temperature on the cognitive test depends on the increased degree of heat stress. With the increase of TSCI, the accuracy and speed of cognitive test show opposite trends, namely the accuracy first increases and then decreases, the speed first drops and then rises. Thus, it gives a new view reflecting the association between heat stress and cognitive performance under high temperature. The TSCI-CP model provides a theoretical basis for evaluating the influence of high temperature on cognitive performance quantitatively. Highlights: Quantify the influence degree of thermal parameters on scores. Propose TSCI from the perspective of cognitive performance. Establish a quantitative relationship model between TSCI and CP. With the increased TSCI, the accuracy and speed of tests show an opposite trend. … (more)
- Is Part Of:
- Building and environment. Volume 207:Part A(2022)
- Journal:
- Building and environment
- Issue:
- Volume 207:Part A(2022)
- Issue Display:
- Volume 207, Issue 1 (2022)
- Year:
- 2022
- Volume:
- 207
- Issue:
- 1
- Issue Sort Value:
- 2022-0207-0001-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-01
- Subjects:
- Cognitive performance -- TSCI-CP model -- Thermal stress -- High temperature -- Moderate activity level
Buildings -- Environmental engineering -- Periodicals
Building -- Research -- Periodicals
Constructions -- Technique de l'environnement -- Périodiques
Electronic journals
696 - Journal URLs:
- http://www.sciencedirect.com/science/journal/03601323 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.buildenv.2021.108431 ↗
- Languages:
- English
- ISSNs:
- 0360-1323
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 2359.355000
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British Library HMNTS - ELD Digital store - Ingest File:
- 20168.xml