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Wang, Y. et al. (2021). Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing. Engineering fracture mechanics. p. . [Online].
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Wang, Y. et al. (2021). Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing. Engineering fracture mechanics. p. . [Online].