Cite
HARVARD Citation
Roumanille, P. et al. (2021). Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging. Microelectronics and reliability. p. . [Online].
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Roumanille, P. et al. (2021). Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging. Microelectronics and reliability. p. . [Online].