Cite
HARVARD Citation
Chen, A. et al. (2022). Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling. Applied thermal engineering. p. . [Online].
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Chen, A. et al. (2022). Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling. Applied thermal engineering. p. . [Online].