Formation of thermal conductive network in boron nitride/polyvinyl alcohol by ice-templated self-assembly. Issue 23 (1st December 2021)

• Record Type: Journal Article
• Authors: Wu, Wenjie; Liu, Hewei; Wang, Zhongyue; Lv, Peng; Hu, Ertao; Zheng, Jiajin; Yu, Kehan; Wei, Wei
• Is Part Of: Ceramics international. Volume 47:Issue 23(2021)
• Page Start: 33926
• Page End: 33929
• Publication Date: 2021-12-01
• Subjects: Thermal conductivity -- Freeze drying -- Hot-pressing -- Aligned hexagonal boron nitride -- Interfacial thermal resistance; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2021.08.266
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: Ceramic/resin composite is an important thermal management material for electronic packaging. The formation of a thermally conductive network of ceramic fillers in the composite is the key to improving thermal conduction performance. We design a method of ice-templated self-assembly followed by hot pressing to prepare oriented boron nitride/polyvinyl alcohol (BN/PVA) composites. First, the BN/PVA aerogel is made by freezing and then freeze-drying. BN flakes are squeezed by ice crystals to form a 3D network at the ice interfaces. After further removing the gaps between the BN flakes by hot pressing, a dense BN/PVA composite material is obtained. The resulting polymer composite has a thermal conductivity up to 10.04 W m −1 K −1 at h-BN content of 68 wt%. Theoretical analysis shows a low interfacial thermal resistance between BN flakes. This approach can potentially be used in advanced electronic packaging technology, especially in the design of thermal interface materials.