Ultrathin metal–organic framework nanosheet arrays and derived self-supported electrodes for overall water splitting. Issue 39 (30th September 2021)

• Record Type: Journal Article
• Authors: Wang, Yanru; Wang, Ani; Xue, Zhenzhen; Wang, Lei; Li, Xiaoyu; Wang, Guoming
• Is Part Of: Journal of materials chemistry. Volume 9:Issue 39(2021)
• Page Start: 22597
• Page End: 22602
• Publication Date: 2021-09-30
• Subjects: Materials -- Research -- Periodicals; Chemistry, Analytic -- Periodicals; Environmental sciences -- Research -- Periodicals; 543.0284
• DOI: 10.1039/d1ta06360j
• Languages: English
• ISSNs: 2050-7488

Abstract

Abstract : The in situ growth of 2D metal–organic framework (MOF) nanosheet arrays on conductive substrates as self-supported electrodes is highly desirable but challenging. Abstract : The in situ growth of 2D metal–organic framework (MOF) nanosheet arrays on conductive substrates as self-supported electrodes is highly desirable but challenging. Herein, we demonstrate for the first time that the in situ growth of 2D Co-MOF nanosheet arrays on nickel foam can be achieved by a CoO nanowall template induced strategy ([Co(bimpy) ( p -bdc) (H2 O)] n, named Co-MOF, bimpy = 2, 5-bis(1 H -imidazol-1-yl)pyridine, p -H2 bdc = p -benzene dicarboxylic acid). The subsequent pyrolysis treatment converts the 2D Co-MOF nanosheet arrays into Ni@CoO@Co-MOFC composites, which can be directly applied as a self-supported electrode for electrocatalysis. Remarkably, Ni@CoO@CoMOFC as a promising electrocatalyst exhibits an excellent electrocatalytic performance of 138 and 247 mV for the HER and OER at a current density of 10 mA cm −2, which surpasses that of most reported Co/CoO-based electrocatalysts. More importantly, a two-electrode electrolyzer fabricated from Ni@CoO@CoMOFC displays a low overpotential of 1.61 V ( η 10 ) toward overall water splitting. This study provides new insights into the development of 2D MOF nanosheet arrays and derived self-supported electrodes with high performance for overall water-splitting.