High heat flux dissipation via interposer active micro-cooling. (4th March 2019)
- Record Type:
- Journal Article
- Title:
- High heat flux dissipation via interposer active micro-cooling. (4th March 2019)
- Main Title:
- High heat flux dissipation via interposer active micro-cooling
- Authors:
- Buja, Federico
Zhang, Lei
Cherman, Vladimir
Oprins, Herman
Ben Jones,
Soussan, Philippe - Abstract:
- Abstract: In this work we demonstrate that high power density of 600 W cm −2 can be effectively dissipated by conductive/convective cooling using a silicon interposer with integrated micro-channels. This technology proved to limit the temperature increase of a 5 mm 2 power chip to only 34 K when operated at 150 W. The cooler technology is developed on a silicon semiconductor platform and is applicable to interposer technologies.
- Is Part Of:
- Japanese journal of applied physics. Volume 58:Number SB(2019)
- Journal:
- Japanese journal of applied physics
- Issue:
- Volume 58:Number SB(2019)
- Issue Display:
- Volume 58, Issue 2019 (2019)
- Year:
- 2019
- Volume:
- 58
- Issue:
- 2019
- Issue Sort Value:
- 2019-0058-2019-0000
- Page Start:
- Page End:
- Publication Date:
- 2019-03-04
- Subjects:
- Physics -- Periodicals
621.05 - Journal URLs:
- http://iopscience.iop.org/1347-4065/ ↗
http://ioppublishing.org/ ↗ - DOI:
- 10.7567/1347-4065/ab002d ↗
- Languages:
- English
- ISSNs:
- 0021-4922
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store - Ingest File:
- 19596.xml