Cite
HARVARD Citation
Sun, F. et al. (2021). Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding. Soldering & surface mount technology. 33 (5), pp. 274-280. [Online].
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Sun, F. et al. (2021). Microstructure evolution and shear strength of full Cu3Sn- microporous copper composite joint by thermo-compression bonding. Soldering & surface mount technology. 33 (5), pp. 274-280. [Online].