Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions. (December 2021)
- Record Type:
- Journal Article
- Title:
- Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions. (December 2021)
- Main Title:
- Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions
- Authors:
- Song, Qianqian
Yang, Wenchao
Li, Yitai
Mao, Jun
Qin, Weiou
Zhan, Yongzhong - Abstract:
- Abstract: Sn–Bi solder is considered a promising lead-free solder which meets the performance requirements with the advantages of low melting point, good wettability and mechanical properties. The interfacial reaction and mechanical properties of Sn58Bi-XCr (X = 0, 0.1, 0.2, 0.3) composite solder joints have been studied. After isothermal aging treatment at 100 °C, the microstructure and reaction mechanism of the interface were analyzed. The results show that the microstructure of Sn58Bi composite solder joint with 0.2wt.% Cr element is obviously refined. At the same time, the average thickness of the interface intermetallic compounds (IMCs) becomes thinner with the addition of Cr content. In addition, the tensile strength of Sn58Bi composite solder joint decreases gradually with the extension of aging time, but the tensile property of Sn58Bi-0.2Cr is better than that of other alloy components. However, with the extension of aging time, the shear strength of Sn58Bi composite solder joints generally decreases at first and then increases, and the fracture morphology of solder joints changes from brittle fracture mechanism to ductile fracture mechanism. Highlights: Adding Cr element into Sn58Bi system can refine the microstructure. The Bi segregation at Sn58Bi-0.2Cr/Cu interface is obviously improved, and the thickness of intermetallic compound at Sn58Bi-0.3Cr interface is the thinnest. Sn58Bi-0.2Cr has better tensile properties than those of other added components. The shearAbstract: Sn–Bi solder is considered a promising lead-free solder which meets the performance requirements with the advantages of low melting point, good wettability and mechanical properties. The interfacial reaction and mechanical properties of Sn58Bi-XCr (X = 0, 0.1, 0.2, 0.3) composite solder joints have been studied. After isothermal aging treatment at 100 °C, the microstructure and reaction mechanism of the interface were analyzed. The results show that the microstructure of Sn58Bi composite solder joint with 0.2wt.% Cr element is obviously refined. At the same time, the average thickness of the interface intermetallic compounds (IMCs) becomes thinner with the addition of Cr content. In addition, the tensile strength of Sn58Bi composite solder joint decreases gradually with the extension of aging time, but the tensile property of Sn58Bi-0.2Cr is better than that of other alloy components. However, with the extension of aging time, the shear strength of Sn58Bi composite solder joints generally decreases at first and then increases, and the fracture morphology of solder joints changes from brittle fracture mechanism to ductile fracture mechanism. Highlights: Adding Cr element into Sn58Bi system can refine the microstructure. The Bi segregation at Sn58Bi-0.2Cr/Cu interface is obviously improved, and the thickness of intermetallic compound at Sn58Bi-0.3Cr interface is the thinnest. Sn58Bi-0.2Cr has better tensile properties than those of other added components. The shear strength of Sn58Bi composite solder joint can be improved by adding proper amount of Cr element. … (more)
- Is Part Of:
- Vacuum. Volume 194(2021)
- Journal:
- Vacuum
- Issue:
- Volume 194(2021)
- Issue Display:
- Volume 194, Issue 2021 (2021)
- Year:
- 2021
- Volume:
- 194
- Issue:
- 2021
- Issue Sort Value:
- 2021-0194-2021-0000
- Page Start:
- Page End:
- Publication Date:
- 2021-12
- Subjects:
- Solder joint -- Interfaces -- Tensile strength -- Shear strength
Vacuum -- Periodicals
621.55 - Journal URLs:
- http://www.elsevier.com/journals ↗
http://www.sciencedirect.com/science/journal/0042207X ↗ - DOI:
- 10.1016/j.vacuum.2021.110559 ↗
- Languages:
- English
- ISSNs:
- 0042-207X
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 9139.000000
British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store - Ingest File:
- 19554.xml