Comparison with Experiment, Model, and Simulation for Thermal Conductive Mechanism of Polymer Composites without Particle Network. Issue 19 (18th August 2021)

• Record Type: Journal Article
• Authors: Feng, Yancong; Chen, Xin; Li, Yongrui; Wang, Yao; Li, Hao; Zhou, Guofu
• Is Part Of: Macromolecular chemistry and physics. Volume 222:Issue 19(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-08-18
• Subjects: 3D crosslinked organosilicone network -- heat transfer path -- molecular dynamics simulation -- SiO2 -- theoretical model; Polymers -- Periodicals; Polymerization -- Periodicals; Synthetic products -- Periodicals; Macromolecules -- Periodicals; 547.7
• DOI: 10.1002/macp.202100200
• Languages: English
• ISSNs: 1022-1352

Abstract

Abstract: Construction of particle network is the most effective strategy for polymer composites with high thermal conductivity. However, the disadvantages of this strategy, such as high particle concentration, complex preparation process, weak mechanical properties or thermodynamic instability, still limit the application. The heat transfer mechanism of polymer composites without particle network remains unclear. In this work, for exploring the heat transfer path of polymer composites without particle network, polymer composites are designed with spherical SiO2 particles grafted by 3D crosslinked organosilicone matrix, to minimize influence of interfacial thermal resistance and crystallization. Combining experiment, theoretical models and coarse‐grained molecular dynamics simulations, it is concluded that the heat fluxes concentrate on the matrix among the particles. Abstract : For exploring the heat transfer path of polymer composites without particle network, polymer composites with SiO2 particles grafted by 3D crosslinked organosilicone matrix is designed to minimize influence of interfacial thermal resistance and crystallization. The heat fluxes concentrate on the matrix among the particles. Good particle dispersion leads to numerous and short heat transfer paths, enhancing the thermal conductivity.