Cite
HARVARD Citation
Chang, T. et al. (2015). Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Microelectronics and reliability. 55 (12), pp. 2582-2588. [Online].
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Chang, T. et al. (2015). Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Microelectronics and reliability. 55 (12), pp. 2582-2588. [Online].