Cite
HARVARD Citation
Tsai, M. et al. (2015). Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectronics and reliability. 55 (12), pp. 2589-2595. [Online].
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Tsai, M. et al. (2015). Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectronics and reliability. 55 (12), pp. 2589-2595. [Online].