Enhanced mechanical properties and thermal conductivity of W-30Cu composite fabricated with monodisperse and nearly spherical W powder. (December 2021)

• Record Type: Journal Article
• Authors: Chen, Zheng; Li, Bingxue; Zhang, Qiao; Ding, Yi; Zhu, Zhixiang; Xiao, Peng; Liang, Shuhua
• Is Part Of: International journal of refractory metals & hard materials. Volume 101(2021)
• Publication Date: 2021-12
• Subjects: W-Cu composite -- W powder -- Homogeneity -- Ductility -- Thermal conductivity; Heat resistant alloys -- Periodicals; Refractory materials -- Periodicals; Metallography -- Periodicals; Alliages réfractaires -- Périodiques; Matériaux réfractaires -- Périodiques; Métallographie -- Périodiques; Heat resistant alloys; Metallography; Refractory materials; Periodicals; Electronic journals; 669.73
• DOI: 10.1016/j.ijrmhm.2021.105663
• Languages: English
• ISSNs: 0263-4368

Abstract

Abstract: In this study, the W-30Cu composite was fabricated by infiltration using monodisperse and nearly spherical W powder, which was prepared via jet milling. Compared with the conventional W-30Cu composite, the microstructure homogeneity of the as-prepared W-30Cu composite has been dramatically improved, and the W-W contiguity and variable coefficient of W grain size are as low as 0.324 and 0.28, respectively. Hence, in both tensile and compressive test, the as-prepared W-30Cu composite exhibits higher strength and ductility. The uniform microstructure also enhances the thermal conductivity of the W-Cu composites at all temperatures. At room temperature, the thermal conductivity of the as-prepared W-30Cu composite is 256.7 W·m −1 ·K −1, reaching 96.9% of the theoretical value. Highlights: The microstructure homogeneity of the W-Cu composite has been dramatically improved. The W-W contiguity and variable coefficient of W grain size are as low as 0.324 and 0.28. The as-prepared W-30Cu composite exhibits higher strength and ductility. The uniform microstructure enhances the thermal conductivity at all temperatures.