31‐2: Optimization of TFE Structure by FTIR Analysis and Mechanical Simulation to Achieve Excellent Encapsulation and High Flexibility AMOLED. Issue 1 (2nd June 2017)

• Record Type: Journal Article
• Authors: Chiou, Ji-Yi; Liu, Yen-Wei; Niu, Yi-Fan; Liu, Sheng-Fa; Kuo, Che-Cheng; Hunag, Ching-Yu; Chiu, Yi-Wen; Lai, Ming-Hsiang
• Is Part Of: Digest of technical papers. Volume 48:Issue 1(2017)
• Page Start: 437
• Page End: 440
• Publication Date: 2017-06-02
• Subjects: FTIR -- Encapsulation -- Mechanical Simulation -- High-Flexibility; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/sdtp.11664
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract : The 2.7 inch flexible AMOELD is successfully demonstrated through FTIR analysis and mechanical simulation. Through FTIR analysis we can optimize the CVD parameter to realize the SiNx of WVTR~10 −5 (60°/90% R.H.). According to the simulation result, the curvature radius can be reduced to 10mm by modulating the Organic Coating for Planarization(OCP) layer thickness.