Simulation and experimental research on subsurface damage of silicon nitride grinding. Issue 7 (May 2018)

• Record Type: Journal Article
• Authors: Wan, Linlin; Liu, Zhijian; Deng, Zhaohui; Li, Le; Liu, Wei
• Is Part Of: Ceramics international. Volume 44:Issue 7(2018)
• Page Start: 8290
• Page End: 8296
• Publication Date: 2018-05
• Subjects: Silicon nitride -- Grinding subsurface damage -- Truncated polyhedra -- Orthogonal experiment -- Finite element simulation; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2018.02.014
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: A finite element model of silicon nitride grinding was created based on virtual abrasives with a truncated polyhedral shape, to simulate the subsurface damage depth. Due to the influence of materials on light reflection, a new method to detect the subsurface damage depth was presented based on the light intensity. A series of orthogonal experiments were accomplished by using a MGK7120 × 6/F NC surface grinder. The influence of the grinding parameters, such as the wheel speed, workpiece speed and grinding depth, were analysed for their effects on the subsurface damage depth. A prediction model of the subsurface damage depth was built by conducting a regression analysis of the experimental data. The results indicated that the average error between the model prediction and experimental testing was approximately 9%, which validated the predication accuracy and the generalization ability of the prediction model.