Highly anisotropic thermal conductivity of mesogenic epoxy resin film through orientation control. Issue 47 (13th July 2021)

• Record Type: Journal Article
• Authors: Tang, Ning; Tanaka, Shingo; Takezawa, Yoshitaka; Kanie, Kiyoshi
• Is Part Of: Journal of applied polymer science. Volume 138:Issue 47(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-07-13
• Subjects: applications -- conducting polymers -- films -- liquid crystals; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.51396
• Languages: English
• ISSNs: 0021-8995

Abstract

Abstract: To develop insulating materials with a high thermally conductive anisotropy, planarly aligned mesogenic epoxy (ME) resin film was fabricated by uniaxial coating on a hydrophobic polyethylene terephthalate substrate. Grazing incidence small‐angle X‐ray scattering (GISAXS) and transmission SAXS measurements exhibited that the films spontaneously formed uniaxially aligned monodomain‐like smectic structures by curing on the hydrophobic substrate. Then, an in‐ and out‐of‐plane thermal conductivity of 10 and 0.048 W m −1 K −1 and outstanding thermal conductivity anisotropy of 208 have been confirmed, respectively. The ME resin films with high thermal conductivity can be applied as insulating materials for multiple‐layer electrical and electronic devices. Abstract : An improvement of thermal conductivity was achieved by coating mesogenic epoxy resin on the hydrophobic PET substrate.