Cite
HARVARD Citation
Monlevade, E. et al. (2021). A critical analysis of a reliability study of ball grid array electronic components submitted to thermal aging and board-level drop test. Engineering failure analysis. p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Monlevade, E. et al. (2021). A critical analysis of a reliability study of ball grid array electronic components submitted to thermal aging and board-level drop test. Engineering failure analysis. p. . [Online].