Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling. (September 2021)

• Record Type: Journal Article
• Authors: Wu, Xulei; Wang, Huatao; Wang, Ziao; Xu, Jinglong; Wu, Yajin; Xue, Rui; Cui, Hongxin; Tian, Cong; Wang, Yu; Huang, Xiaoxiao; Zhong, Bo
• Is Part Of: Carbon. Volume 182(2021)
• Page Start: 445
• Page End: 453
• Publication Date: 2021-09
• Subjects: Graphite nanoplatelets -- Thermal conductivity -- Orientation -- Vertically aligned -- Hot pressing; Carbon -- Periodicals; Carbone -- Périodiques; Koolstof; Toepassingen; Electronic journals; 546.681
• DOI: 10.1016/j.carbon.2021.06.048
• Languages: English
• ISSNs: 0008-6223

Abstract

Abstract: Thermal interface materials (TIMs) play a crucial role in enhancing the reliability and sustainable utilization of next-generation electronics and thus can help meet the increasing demand for multifunctional devices with higher performance. Herein, we introduce a method for creating a TIM with high cross-plane thermal conductivity based on graphite nanoplatelet (GNP)/polyurethane (PU) films. The graphite nanoplatelets ensured the heat transfer properties of the TIM. Moreover, the hot-pressing procedure improved the thermal conductivity to 26.3 W (m K) −1 with the improved orientation of the GNPs in the PU matrix, as confirmed by microscopy investigation. Under a thermal dissipation power of 10–20 W, a drastic reduction in the chip temperature (17.5–42.3 °C) was achieved using our oriented GNP/PU TIM compared to a commercial silicone TIM (5.0 W (m K) −1 ). In addition, as-prepared pads can be mass produced at an acceptable cost, indicating that our work provides a promising new approach to fabricating TIMs for application in the next-generation thermal management of high power density electronics. Graphical abstract: Image 1