Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices. (August 2021)

Record Type:
Journal Article
Title:
Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices. (August 2021)
Main Title:
Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices
Authors:
Nowakowski, Pawel
Ray, Mary
Fischione, Paul
Abstract:
Is Part Of:
Microscopy and microanalysis. Volume 27:Supplement 1(2021)
Journal:
Microscopy and microanalysis
Issue:
Volume 27:Supplement 1(2021)
Issue Display:
Volume 27, Issue 1 (2021)
Year:
2021
Volume:
27
Issue:
1
Issue Sort Value:
2021-0027-0001-0000
Page Start:
788
Page End:
790
Publication Date:
2021-08
Subjects:
Microscopy -- Periodicals
Microchemistry -- Periodicals
502.82
Journal URLs:
https://academic.oup.com/mam ↗
http://journals.cambridge.org/action/displayJournal?jid=MAM ↗
http://link.springer.de/link/service/journals/10005/index.htm ↗
http://firstsearch.oclc.org ↗
DOI:
10.1017/S1431927621003135 ↗
Languages:
English
ISSNs:
1431-9276
Deposit Type:
Legaldeposit
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:
British Library HMNTS - ELD Digital store
Ingest File:
18021.xml