Pottery Clay: An Aid to Stabilize the Metal Components During Soldering. Issue 4 (October 2021)
- Record Type:
- Journal Article
- Title:
- Pottery Clay: An Aid to Stabilize the Metal Components During Soldering. Issue 4 (October 2021)
- Main Title:
- Pottery Clay: An Aid to Stabilize the Metal Components During Soldering
- Authors:
- Ram, RSVM Raghu
Ranganayakulu, I
Viswanadh, K Anand - Abstract:
- Lack of stabilization of metal components during soldering is the most common problem encountered in orthodontic lab work. Metal components tend to slip or change from their actual position during soldering. This article provides a simple tip for easy and steady positioning of metal components during the soldering procedure using pottery clay.
- Is Part Of:
- Journal of Indian Orthodontic Society. Volume 55:Issue 4(2021)
- Journal:
- Journal of Indian Orthodontic Society
- Issue:
- Volume 55:Issue 4(2021)
- Issue Display:
- Volume 55, Issue 4 (2021)
- Year:
- 2021
- Volume:
- 55
- Issue:
- 4
- Issue Sort Value:
- 2021-0055-0004-0000
- Page Start:
- 429
- Page End:
- 430
- Publication Date:
- 2021-10
- Subjects:
- Metal components -- soldering -- pottery clay
Orthodontics -- Periodicals
617.643 - Journal URLs:
- https://journals.sagepub.com/home/jio ↗
- DOI:
- 10.1177/0301574220965304 ↗
- Languages:
- English
- ISSNs:
- 0301-5742
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 17986.xml