WCu functionally graded material: Low temperature fabrication and mechanical characterization. (April 2018)

• Record Type: Journal Article
• Authors: Yusefi, Ali; Parvin, Nader; Mohammadi, Hossein
• Is Part Of: Journal of physics and chemistry of solids. Volume 115(2018)
• Page Start: 26
• Page End: 35
• Publication Date: 2018-04
• Subjects: Energy dispersive X-ray spectroscopy -- Functionally graded material -- Mechanical property -- Scanning electron microscopy -- Tungsten-copper; Solids -- Periodicals; Solides -- Périodiques; Solids; Periodicals; 530.41
• DOI: 10.1016/j.jpcs.2017.11.029
• Languages: English
• ISSNs: 0022-3697

Abstract

Abstract: In this study, we fabricated and characterized a WCu functionally graded material (FGM) with 11 layers, including a pure copper layer. Samples were prepared by mixing a mechanically alloyed NiMnCu powder with W and Cu powders, stacking the powders, pressing the stacked layers, and finally sintering at 1000 °C. The utilization of a NiMnCu system may reduce the cost but without losing the good sintering behavior and physical and mechanical properties. The composition of the material was analyzed based on scanning electron microscopy images and by energy dispersive X-ray spectroscopy mapping, which indicated that in the presence of Ni and Mn, the Cu atoms could diffuse into the W particles. All of the layers had a very high relative density, thereby indicating their densification and excellent sintering behavior. We also found that the porosity values in the Cu phase remained unchanged at approximately 2.39% across the FGM. Mechanical measurements showed that the hardness (72%), modulus of elasticity (61%), and ultimate tensile strength (58%) increased with the W content across the WCu FGM, whereas the fracture toughness (KIC ) varied in the opposite manner (minimum of 4.52 MPa/m 0.5 ). Highlights: WCu functionally graded material (FGM) with 11 layers (+Cu) fabricated at 1000 °C. FGM had a well-graded compositional transition from the W side to the Cu side. Contiguity, hardness of layers, modulus of elasticity, UTS, and KIC determined. Introducing NiMnCu binder into W matrix improved the solid sintering behavior.