Cite
HARVARD Citation
Drummond, K. et al. (2018). A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics. International journal of heat and mass transfer. pp. 319-330. [Online].
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Drummond, K. et al. (2018). A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics. International journal of heat and mass transfer. pp. 319-330. [Online].