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HARVARD Citation
He, K. et al. (2018). An improved unit circuit model for transient heat conduction performance analysis and optimization in multi-layer materials. Applied thermal engineering. pp. 1551-1562. [Online].
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He, K. et al. (2018). An improved unit circuit model for transient heat conduction performance analysis and optimization in multi-layer materials. Applied thermal engineering. pp. 1551-1562. [Online].