Cite
HARVARD Citation
Wu, C. et al. (2021). Effects of tool rake angle and workpiece surface roughness on nanocutting of cu investigated using Multiscale simulation. Molecular simulation. 47 (12), pp. 1010-1016. [Online].
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Wu, C. et al. (2021). Effects of tool rake angle and workpiece surface roughness on nanocutting of cu investigated using Multiscale simulation. Molecular simulation. 47 (12), pp. 1010-1016. [Online].