Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation. (August 2021)
- Record Type:
- Journal Article
- Title:
- Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation. (August 2021)
- Main Title:
- Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation
- Authors:
- Ye, Yuxin
Liu, Ruiwen
Du, Xiangbin
Zhang, Nan
Kong, Yanmei
Jiao, Binbin
Chen, Dapeng - Abstract:
- Highlights: A multidimensional test vehicle for embedding cooling evaluation. The comparison of different heat sources is realized through the thermal test chip. The thermo-hydraulic performance of microfluidic structure is evaluated by multidimensional contents. Abstract: As the critical dimension size of integrated circuits continues to decrease, the integration density increases dramatically, and they are facing sever heat dissipation challenges. Embedding microfluidic structure directly inside the chip is a promising approach for eliminating the relatively large heat fluxes in interlayer configurations. Considerable research efforts have been devoted to the design and optimization to obtain better cooling performance. Although the previous work analyzed the embedded cooling from different aspects, there are common points in the research contents. This paper refined the common contents in the research and proposed a multidimensional test vehicle. It can not only predict the thermal behavior of different electronic devices, but also evaluate cooling schemes composed of various microfluidic and manifold structures.The results show that the test vehicle can eliminate up to 5.4 kW / cm 2 of heat flux within 1 mm 2, and control the total thermal resistance under 0.076 K · cm 2 / W . Therefore, the multidimensional test vehicle provides a useful tool for evaluating the thermo-hydraulic performance of embedded microfluidic cooling. Moreover, it offers a research method forHighlights: A multidimensional test vehicle for embedding cooling evaluation. The comparison of different heat sources is realized through the thermal test chip. The thermo-hydraulic performance of microfluidic structure is evaluated by multidimensional contents. Abstract: As the critical dimension size of integrated circuits continues to decrease, the integration density increases dramatically, and they are facing sever heat dissipation challenges. Embedding microfluidic structure directly inside the chip is a promising approach for eliminating the relatively large heat fluxes in interlayer configurations. Considerable research efforts have been devoted to the design and optimization to obtain better cooling performance. Although the previous work analyzed the embedded cooling from different aspects, there are common points in the research contents. This paper refined the common contents in the research and proposed a multidimensional test vehicle. It can not only predict the thermal behavior of different electronic devices, but also evaluate cooling schemes composed of various microfluidic and manifold structures.The results show that the test vehicle can eliminate up to 5.4 kW / cm 2 of heat flux within 1 mm 2, and control the total thermal resistance under 0.076 K · cm 2 / W . Therefore, the multidimensional test vehicle provides a useful tool for evaluating the thermo-hydraulic performance of embedded microfluidic cooling. Moreover, it offers a research method for improving the cooling potential through the integration of microfluidics and thermal analysis. … (more)
- Is Part Of:
- Applied thermal engineering. Volume 195(2021)
- Journal:
- Applied thermal engineering
- Issue:
- Volume 195(2021)
- Issue Display:
- Volume 195, Issue 2021 (2021)
- Year:
- 2021
- Volume:
- 195
- Issue:
- 2021
- Issue Sort Value:
- 2021-0195-2021-0000
- Page Start:
- Page End:
- Publication Date:
- 2021-08
- Subjects:
- Thermal test vehicle -- Embedded cooling -- Multidimensional
Heat engineering -- Periodicals
Heating -- Equipment and supplies -- Periodicals
Periodicals
621.40205 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13594311 ↗
http://www.elsevier.com/homepage/elecserv.htt ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.applthermaleng.2021.117149 ↗
- Languages:
- English
- ISSNs:
- 1359-4311
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 1580.101000
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British Library HMNTS - ELD Digital store - Ingest File:
- 17545.xml