P‐39: Detachment of Polymeric Substrate Using CO2 Point Laser for Large‐Area Flexible Display: An Alternative Approach for Laser Lift‐Off. Issue 1 (28th June 2021)

• Record Type: Journal Article
• Authors: Park, Hyuk; Seong, Suwon; Park, Seongmin; Seo, Taewon; Chung, Yoonyoung
• Is Part Of: Digest of technical papers. Volume 52:Issue 1(2021)
• Page Start: 1208
• Page End: 1210
• Publication Date: 2021-06-28
• Subjects: Flexible display -- detachment -- carrier wafer -- LLO -- point laser; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/sdtp.14914
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract : We present a new method of detaching flexible substrate from rigid carrier wafer using a CO2 point laser. A laser lift‐off detachment is mostly used detaching method in the fabrication of large‐area flexible display; however, illumination and thermal stresses on electronic devices due to the laser beam energy are still problems. Our approach using a point laser does not impose laser‐induced stress on electronic components. To minimize the de‐bonding stress, we precisely controlled the adhesion between flexible substrate and carrier wafer by simple modification on the carrier surface. A flexible indium‐tin‐oxide film exhibited almost no change on its resistance value after detachment.