59‐4: A New Method of Side‐wiring Bonding and Patterning for Micro‐LED Display on Glass Substrate. Issue 1 (28th June 2021)

• Record Type: Journal Article
• Authors: Qi, Yonglian; Qu, Lianjie; Zhang, Shan; Zhao, Hebin; Yang, Ruizhi; Qiu, Yun; Wang, Dan; Liu, Chao; Gong, Linhui
• Is Part Of: Digest of technical papers. Volume 52:Issue 1(2021)
• Page Start: 837
• Page End: 840
• Publication Date: 2021-06-28
• Subjects: Large size Micro LED -- Side-wiring bonding -- Splice -- half hole on the edge; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/sdtp.14813
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract : This paper reported a new method of side‐wiring bonding on glass substrate and patterned for large size micro‐LED display. In our experiment, the half hole first fabricated on the side edge of the glass substrate, then the metal was pasted on the side edge, through grounding the metal on the convex edge to form a side metal pattern, The results showed that this scheme can form a conductive side metal pattern for splicing large size micro LED display. This new side‐wiring bonding method can reduce the joint pitch between single glass substrate, and the metal in the hole can be better protected, so as to realize better large size micro LED splicing quality.