Cite
HARVARD Citation
Su, F. et al. (2014). Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package. Journal of mechanics. pp. 625-630. [Online].
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Su, F. et al. (2014). Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package. Journal of mechanics. pp. 625-630. [Online].