Scattering of SH-Wave by a Circular Inclusion Near the Interfacial Cracks in the Piezoelectric Bi-Material Half-Space. (24th January 2017)

• Record Type: Journal Article
• Authors: Qi, H.; Zhang, X. M.
• Is Part Of: Journal of mechanics. Volume 34:Number 3(2018)
• Page Start: 337
• Page End: 347
• Publication Date: 2017-01-24
• Subjects: Piezoelectric bi-material -- Circular inclusion -- Dynamic stress concentration factor (DSCF) -- Dynamic stress intensity factor (DSIF); Mechanics, Analytic -- Periodicals; Mechanics -- Periodicals; 620.1005
• DOI: 10.1017/jmech.2017.7
• Languages: English
• ISSNs: 1727-7191

Abstract

Abstract : With the aid of the Green's function method and complex function method, the scattering problem of SH-wave by a circular inclusion near the two symmetrically permeable interfacial cracks in the piezoelectric bi-material half -space is considered to obtain the steady state response. Firstly, by means of the image method, the essential function of Green's function is constructed, which satisfies the stress free and electric insulation conditions on the horizontal boundaries in a right-angle space including a circular inclusion and bearing a harmonic out-plane line source force on the vertical boundary. Secondly, the bi-material media is divided into two parts along the vertical boundary. According to continuity condition, the first kind of Fredholm integral equations containing undetermined anti-plane forces are established by "the conjunction method" and "the crack-division technology", then the integral equations are reduced to the algebraic equations including finite items by effective truncation. Finally, the dynamic stress concentration factor around the edge of circular inclusion and dynamic stress intensity factor at the crack tip are calculated, then the influences of the frequency of incident wave, the length of crack, the position of the crack, the position of circular inclusion, etc. on the dynamic stress concentration factor and dynamic stress intensity factor are discussed.