Athermal silicon optical interposers with quantum dot lasers operating from 25 to 125°C. Issue 19 (1st September 2014)

• Record Type: Journal Article
• Authors: Urino, Y.; Hatori, N.; Akagawa, T.; Shimizu, T.; Okano, M.; Ishizaka, M.; Yamamoto, T.; Okayama, H.; Onawa, Y.; Takahashi, H.; Shimura, D.; Yaegashi, H.; Nishi, H.; Fukuda, H.; Yamada, K.; Miura, M.; Fujikata, J.; Akiyama, S.; Baba, T.; Usuki, T.; Noguchi, Y.; Noguchi, M.; Imai, M.; Hirayama, N.; Saitou, S.; Yamagishi, M.; Takahashi, M.; Saito, E.; Okamoto, D.; Mori, M.; Horikawa, T.; Nakamura, T.; Arakawa, Y.;
• Is Part Of: Electronics letters. Volume 50:Issue 19(2014)
• Page Start: 1377
• Page End: 1378
• Publication Date: 2014-09-01
• Subjects: silicon -- elemental semiconductors -- optical interconnections -- integrated optoelectronics -- quantum dot lasers -- large scale integration; Si -- bit rate 12.5 Gbit/s -- temperature 25 degC to 125 degC -- maximum junction temperatures -- error‐free data links -- single silicon substrate -- temperature‐insensitive components -- mounted large‐scale integration chips -- inter‐chip interconnects -- quantum dot lasers -- athermal silicon optical interposers; Electronics -- Periodicals; 621.381
• DOI: 10.1049/el.2014.2135
• Languages: English
• ISSNs: 0013-5194

Abstract

Abstract : Interposers for inter‐chip interconnects should perform stably under high‐temperature conditions and rapid temperature change due to the heat generated by mounted large‐scale integration (LSI) chips. Athermal silicon optical interposers integrated with quantum dot lasers and other temperature‐insensitive components on a single silicon substrate are demonstrated, and error‐free data links at 12.5 Gbit/s operating from 25 to 125°C are achieved without any bias adjustment. Since maximum junction temperatures in most LSIs have been below 125°C now and will be in the future, the interposers are tolerant of heat generated by LSIs, and are suitable for inter‐chip interconnects.