Cite
HARVARD Citation
Li, J. et al. (2019). Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips. Energy conversion and management. p. . [Online].
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Li, J. et al. (2019). Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips. Energy conversion and management. p. . [Online].