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HARVARD Citation
Kim, J. et al. (2021). Continuously thermal conductive pathway of bidisperse boron nitride fillers in epoxy composite for highly efficient heat dissipation. Materials today communications. p. . [Online].
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Kim, J. et al. (2021). Continuously thermal conductive pathway of bidisperse boron nitride fillers in epoxy composite for highly efficient heat dissipation. Materials today communications. p. . [Online].