Influences of nanoparticle content on electrical and thermal performances of micro‐nano hybrid composites for packaging materials. Issue 36 (26th April 2021)

• Record Type: Journal Article
• Authors: Dai, Chao; Chen, Xiangrong; Meng, Fanbo; Jiang, Tie; Paramane, Ashish; Tanaka, Yasuhiro
• Is Part Of: Journal of applied polymer science. Volume 138:Issue 36(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-04-26
• Subjects: electrical and thermal performances -- epoxy hybrid composites -- packaging material -- space charge characteristics; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.50909
• Languages: English
• ISSNs: 0021-8995

Abstract

Abstract: This paper presents electrical and thermal properties of a novel type of micro‐nano hybrid composites to be potential for packaging. The micro‐nano hybrid composites contain 20 wt% of micro‐aluminium nitride (AlN) with 1, 3, and 5 wt% of nano‐AlN, respectively. Electrical measurement and thermal analysis are used to analyze the performances. The results show that the nano‐AlN in the hybrid composites can suppress the space charge accumulation near the cathode and facilitate the conversion of hetero charge into the homo‐charge accumulations near the anode. No apparent electric field distortion can be observed in the M20N3 sample, whereas it exhibits a minimum electrical conductivity and highest thermal conductivity amongst all samples. Furthermore, the nano‐filler addition can enhance the DC breakdown strength and the thermal stability of the hybrid composites. The thermal and electrical conduction mechanism of the micro and nano fillers in the hybrid composites is also elucidated. Abstract : In this paper, comprehensive electrical measurements and thermal analysis are used to investigate the electrical and thermal performance of the micro‐nano hybrid composites. The thermal and electrical conduction mechanism of the micro and nano fillers in the hybrid composites is also elucidated. The work can provide a theoretical basis and reference for the high‐voltage electrical, power electronic packaging, aerospace equipment and other engineering fields.