An analytical model to predict the depth of sub-surface damage for grinding of brittle materials. (May 2021)

• Record Type: Journal Article
• Authors: Yin, Jingfei; Bai, Qian; Goel, Saurav; Zhou, Ping; Zhang, Bi
• Is Part Of: CIRP journal of manufacturing science and technology. Volume 33(2021)
• Page Start: 454
• Page End: 464
• Publication Date: 2021-05
• Subjects: DOC Depth of cut -- FEM Finite element method -- L-C Lomer-Cottrell lock type of dislocations -- SSD Sub-surface damage -- MD Molecular dynamics -- HPPT High pressure phase transformation -- BK7 A grade of Borosilikatglas from Schott Glaswerke AG; Silicon -- Analytical model -- Sub-surface damage -- Dislocation -- Fracture mechanics; Manufacturing processes -- Periodicals; 670.5
• DOI: 10.1016/j.cirpj.2021.03.019
• Languages: English
• ISSNs: 1755-5817

Abstract

Graphical abstract: Highlights: We propose an analytical model to predict sub-surface damage during the grinding of silicon. The model is based on the theory of dislocation kinetics and fracture mechanics. The model also considers the strain rate effects in predicting the deformation. The model was experimentally validated to further optimize the grinding of silicon. Abstract: This paper proposes an analytical model for predicting grinding-induced sub-surface damage depth in a silicon wafer. The model integrates the dislocation kinetics for crack initiation and fracture mechanics for crack propagation for the first time. Unlike other conventional models, the proposed model considers the effects of strain rate on damage depth and the dynamically changing metastable phase change properties. The model is verified by grinding experiments and a comparison of theoretical and experimental results shows a good quantitative agreement. It is found that increasing grinding speed and decreasing depth of cut cause a higher strain rate so as to enhance material brittleness, which is favorable to achieving low sub-surface damage. These findings will pave a way towards optimizing the grinding parameters and greatly improving the production efficiency of hard and brittle materials.