A facile solution-based metallisation method without harsh conditions and expensive activators for paper substrate and its application in flexible supercapacitor. (July 2021)
- Record Type:
- Journal Article
- Title:
- A facile solution-based metallisation method without harsh conditions and expensive activators for paper substrate and its application in flexible supercapacitor. (July 2021)
- Main Title:
- A facile solution-based metallisation method without harsh conditions and expensive activators for paper substrate and its application in flexible supercapacitor
- Authors:
- Zhang, Qia
Kang, Ling
Zou, JianXiong
Huang, Chun
Gong, Zhiwei
Zhang, Jian - Abstract:
- Graphical abstract: Highlights: The solution-based Au/Ni-P metallisation of cellulose papers was realized. Au/Ni-P composites offer high conductivity and mechanical stability. Au/Ni-P metallisation of cellulose papers exhibit excellent flexibility. Abstract: Sustainable and low-cost cellulose-based metallisation is the prerequisite for wearable and disposable electronics fabrication. In this paper, to realize the simplified, low-cost and high efficient metallisation, a new method had been proposed without both the noble metal activators and the corrosive chemicals. The modified electroless plating processes had been employed in activation and deposition procedure. The nickel ions were first physiadsorbed on the cellulose paper (CP) fibers and then reduced into clusters by reducing agent which can act as the seeds to initiate the electroless plating process. The gold galvanic displacement was conducted further to modify the nickel surface. Via these processes, the cellulose paper was metallised with Ni-P and Au/Ni-P successfully. The morphological and microstructural properties of the resulted Ni-P/CP and Au/Ni-P/CP hybrids were evaluated. The Ni-P/CP composites had a low surface resistance below 0.5 Ω sq -1 while the Au/Ni-P/CP composites are below 0.1 Ω sq -1 . The relationship between the mechanical and electrical properties with the plating parameters is discussed. The results indicated that Au/Ni-P/CP had good electrical conductivity and mechanical flexibility. Finally,Graphical abstract: Highlights: The solution-based Au/Ni-P metallisation of cellulose papers was realized. Au/Ni-P composites offer high conductivity and mechanical stability. Au/Ni-P metallisation of cellulose papers exhibit excellent flexibility. Abstract: Sustainable and low-cost cellulose-based metallisation is the prerequisite for wearable and disposable electronics fabrication. In this paper, to realize the simplified, low-cost and high efficient metallisation, a new method had been proposed without both the noble metal activators and the corrosive chemicals. The modified electroless plating processes had been employed in activation and deposition procedure. The nickel ions were first physiadsorbed on the cellulose paper (CP) fibers and then reduced into clusters by reducing agent which can act as the seeds to initiate the electroless plating process. The gold galvanic displacement was conducted further to modify the nickel surface. Via these processes, the cellulose paper was metallised with Ni-P and Au/Ni-P successfully. The morphological and microstructural properties of the resulted Ni-P/CP and Au/Ni-P/CP hybrids were evaluated. The Ni-P/CP composites had a low surface resistance below 0.5 Ω sq -1 while the Au/Ni-P/CP composites are below 0.1 Ω sq -1 . The relationship between the mechanical and electrical properties with the plating parameters is discussed. The results indicated that Au/Ni-P/CP had good electrical conductivity and mechanical flexibility. Finally, the application demonstration for supercapacitor with the modified metallisation method was exhibited. This work offers a facile and non-toxic path to develop high-performance metallisation for functional cellulose-based materials. … (more)
- Is Part Of:
- Materials & design. Volume 205(2021)
- Journal:
- Materials & design
- Issue:
- Volume 205(2021)
- Issue Display:
- Volume 205, Issue 2021 (2021)
- Year:
- 2021
- Volume:
- 205
- Issue:
- 2021
- Issue Sort Value:
- 2021-0205-2021-0000
- Page Start:
- Page End:
- Publication Date:
- 2021-07
- Subjects:
- Metallisation -- Paper substrate -- Electroless plating processes -- Supercapacitor
Materials -- Periodicals
Engineering design -- Periodicals
Matériaux -- Périodiques
Conception technique -- Périodiques
Electronic journals
620.11 - Journal URLs:
- http://catalog.hathitrust.org/api/volumes/oclc/9062775.html ↗
http://www.sciencedirect.com/science/journal/02641275 ↗
http://www.sciencedirect.com/science/journal/02613069 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.matdes.2021.109742 ↗
- Languages:
- English
- ISSNs:
- 0264-1275
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5393.974000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 17226.xml